Fully-funded Scholarships
Geneva Switzerland Technical Studentship Scholarship 2024 (Materials & Surface Science)
The Technical Studentship in Material & Surface Science 2024-3 offers a unique opportunity for students to gain invaluable work experience at CERN, the European Organization for Nuclear Research. This full-time studentship in Geneva, Switzerland, provides a monthly allowance, comprehensive health insurance, and the chance to work at the forefront of scientific research.
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This article covers the benefits, eligibility criteria, and application process for this prestigious programme.
Benefits
- Contract Duration: 4 to 12 months
- Monthly Allowance: 3452 Swiss Francs (net of tax)
- Travel Allowance: Provided
- Family Allowance: Supplement for married students and/or those with children
- Health Insurance: Comprehensive coverage by CERN’s scheme (deducted from allowance)
- Paid Leave: 2.5 days per month
Eligibility Criteria
To qualify for this programme, applicants must meet the following criteria:
- Be a national of a CERN Member or Associate Member State.
- Have completed at least 18 months of undergraduate studies (Bachelor or Master’s) by October 2024.
- Remain registered as a full-time student during the internship.
- Have a good knowledge of English or French.
Application Process
- Prepare the required documents in English or French, labeled appropriately, and in PDF format.
- Submit your application on CERN’s here: https://jobs.smartrecruiters.com/CERN/743999994830836-technical-studentship-material-surface-science-2024-3?trid=c3270850-b100-4fd2-8aad-40a973eec45a
- Ensure all documents are ready before starting your application as they cannot be added later, except for reference letters which can be submitted separately by your referee.
Deadline: Submit your application by July 29th, 2024 (23:59 CET).
Required Documents:
- CV: Clearly labeled and in PDF format.
- Academic Transcript: Ensure it is not protected if downloaded from a university portal.
- Reference Letter: Mandatory from a University Professor; additional letters from previous internships are welcome.