Geneva Switzerland Technical Studentship Scholarship 2024 (Materials & Surface Science)

The Technical Studentship in Material & Surface Science 2024-3 offers a unique opportunity for students to gain invaluable work experience at CERN, the European Organization for Nuclear Research. This full-time studentship in Geneva, Switzerland, provides a monthly allowance, comprehensive health insurance, and the chance to work at the forefront of scientific research.

This article covers the benefits, eligibility criteria, and application process for this prestigious programme.

Benefits

• Contract Duration: 4 to 12 months
• Monthly Allowance: 3452 Swiss Francs (net of tax)
• Travel Allowance: Provided
• Family Allowance: Supplement for married students and/or those with children
• Health Insurance: Comprehensive coverage by CERN’s scheme (deducted from allowance)
• Paid Leave: 2.5 days per month

Eligibility Criteria

To qualify for this programme, applicants must meet the following criteria:

• Be a national of a CERN Member or Associate Member State.
• Have completed at least 18 months of undergraduate studies (Bachelor or Master’s) by October 2024.
• Remain registered as a full-time student during the internship.
• Have a good knowledge of English or French.

Application Process

1. Prepare the required documents in English or French, labeled appropriately, and in PDF format.
2. Submit your application on CERN’s here: https://jobs.smartrecruiters.com/CERN/743999994830836-technical-studentship-material-surface-science-2024-3?trid=c3270850-b100-4fd2-8aad-40a973eec45a
3. Ensure all documents are ready before starting your application as they cannot be added later, except for reference letters which can be submitted separately by your referee.

Deadline: Submit your application by July 29th, 2024 (23:59 CET).

Required Documents:

• CV: Clearly labeled and in PDF format.
• Academic Transcript: Ensure it is not protected if downloaded from a university portal.
• Reference Letter: Mandatory from a University Professor; additional letters from previous internships are welcome.